ABSTRACT

In recent years, the fabrication house has played a major role in the very-large-scale integration (VLSI) industry to design next-generation high-speed, high-performance integrated circuits (ICs). For a better understanding of fabrication aspects, this chapter briefly explains the historical aspects and concept of VLSI scaling from scratch. Based on the Moore's law, the journey of ICs including analog and digital circuits has been explored in this chapter. In order to understand the fabrication process, this chapter starts with a brief overview of the silicon wafer. Consequently, the production of the raw material with detailed major fabrication steps involved in the VLSI industry are explained. Furthermore, the basic idea of complementary metal oxide semiconductor (CMOS) technology is also incorporated in this chapter in order to have an understanding of N/P-well and twin-tub CMOS process.