ABSTRACT
Components of precision devices, such as those found in optical, communication, and medical applications, require high form accuracy and ne surface nish. One strategy for manufacturing highly precise components is to employ the precision cutting or grinding processes to form the desired shape and the loose-abrasive nishing processes with extremely low material removal rates to smooth the surface. Lapping and polishing are loose-abrasive nishing processes that are among the commonly used methods for implementing this strategy.
