ABSTRACT
This chapter examines system in package (SIP) is regarded as a heterogeneous integration, including chips or modules stacked vertically to realize a three-dimentional structure; and embedded digital, radio frequency (RF), and optical components; and the system integrated into a miniaturized packaging system. SIP focuses on achieving the highest value for a single packaged microsystem. SIP based on packaged module stacking has a more appealing manufacturing cost. The size of the SIP wires is much larger than that of system on chip, which facilitates internal interconnection of high quality. Technically, the RF micro electromechanical system package is the interface between internal devices and external circuits or systems, and it must provide protection and interconnection. The integration with ceramic stackup and interconnection may change the RF chracteristics of the package. Micromachining may optimize the structure of transmission lines and elevate the integration, and the use of this technology must take into consideration compatibility with package-level interconnection.
