ABSTRACT
The current trend to fabricate modern wireless systems featuring high-frequency performance and high-speed digital capability, such as third-generation mobile cellular phones, takes advantage of the MCM approach. It is an advanced assembly technology that allows high-performance RF/mm-wave ICs, highly integrated digital ICs, and low-cost compact passive components such as filters, couplers, balanced-to-unbalanced transformers (baluns), diplexer, etc., to be packaged together. This solution represents a flexible and cost-effective alternative to the fully integrated approach because it allows individual parts of a complex system to be fabricated separately using the most suitable technology. The availability of high-quality integrated passive devices (IPDs) fabricated on insulating substrates, such as glass, is a key factor that enables cost-competitive solutions for such systems.
