ABSTRACT
Heat transport has always been and will always be an important factor dening almost every industrial process, which involves the generation of heat and cooling. Since the industrial revolution, conveying heat either to cool down a component (as an unwanted by-product) or simply to convert it and reuse it (for example in a thermodynamic cycle), presented the designers with a number of challenges as heat handling, in the vast majority of applications, denes the thermodynamic efciency or/and the performance of the process designers are designing for. The industry since then is trending toward downsizing while at the same time component performance is increasing. Meanwhile, the micro-and nanoelectronics industry and the development for the information and technology sector is booming as the human race is, for the rst time, aligning collectively its efforts and demands for more information, more processing power, more networking, and eventually (and hopefully) more socializing than ever before.
