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3D Integration for VLSI Systems
DOI link for 3D Integration for VLSI Systems
3D Integration for VLSI Systems book
3D Integration for VLSI Systems
DOI link for 3D Integration for VLSI Systems
3D Integration for VLSI Systems book
Edited ByChuan Seng Tan, Kuan-Neng Chen, Steven J. Koester
Edition 1st Edition
First Published 2011
eBook Published 7 December 2011
Pub. Location New York
Imprint Jenny Stanford Publishing
Pages 350
eBook ISBN 9780429067464
Subjects Engineering & Technology
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Koester, S.J., Chen, K.-N., & Tan, C.S. (Eds.). (2011). 3D Integration for VLSI Systems (1st ed.). Jenny Stanford Publishing. https://doi.org/10.1201/b11167
ABSTRACT
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
