ABSTRACT
As early as a few thousand years ago, metals were joined together by utilizing low-melting alloys. Beginning with the ‘‘electronic age,’’ solder joints served two functions: to conduct electricity, and to create a joint with sufficient mechanical integrity. With the continuous reduction in solder joint dimensions required inmicroelectronics, the ability to adequatelywet the solder surfaces has become increasingly important. Therefore, there is an increased reliance on inerting to assure functionality and sound solder joints.
