ABSTRACT
Lead-free soldering is an urgent matter in the electronics industry. In order to achieve lead-free soldering in electrical appliances, securing the bonding reliability in mounting electronic parts is indispensable, and the surface treatment of the electrode in the electronic parts is a major technology in addition to the development of lead-free solder. From such a viewpoint, studies concerning lead-free plating of Sn or Sn alloy such as SnAg, Sn-Bi, Sn-Cu, Sn-Zn, etc., which include Sn as a matrix, on the electrode of electronic parts were aggressively carried out to impart solderability, and introductions and explanations have been reported recently [1-5]. However, neither lead-free soldering nor a plating process corresponding to soldering has been adopted by each electric manufacturer under a unified concept at present. In this report, the basic science of Sn and Sn-based alloy plating, the features of each plating bath, and film properties will be introduced.
