ABSTRACT
Electronics is undoubtedly the largest and most rapidly changing industrial sector. It is facing the twin challenges of miniaturization and environment. The first has led to a much greater focus upon mechanical behavior and structural integrity of interconnections, particularly since the emergence of Surface Mount Technology (SMT). The second has necessitated the development of a new class of solder alloy that contains no lead. Electronics equipment is generally conveniently small and relatively inexpensive, and this has facilitated whole scale testing, usually under accelerated service-like conditions, prior to marketing. The number of parameters associated with the printed wiring board (PWB)—component type and arrangement, and service conditions-is substantial. The common practice of extensive empirical testing is becoming unwieldy, inefficient, and sometimes incapable of meeting reliability requirements. There is much potential in adopting the strategies of other high temperature engineering applications, such as power generation, and attempting to design interconnections from first principles. Such an approach is sometimes described in the electronics field as the “Physics of Failure.” This is not to suggest that empirical testing should be replaced, but rather that a better balance between evaluation modes and a greater mutual appreciation should be sought.
