ABSTRACT
The assembly of the basic power IGBT module (or the power section of the intelligent power IGBT module IPM) is made up of cleaning, solder attaching, power interconnecting, dispensing, and encapsulation hybrid circuit processes. The specific nature and details of these processes will be described in this chapter. During production, the processes are closely monitored by inspection sites that are positioned strategically along the entire assembly line. This ensures that the final product meets the initial design goal or specifications. The finished products are stress screened, fully tested, and then sample life tested to guarantee long-term reliability. Also, to achieve as much of a void-free solder attachment as possible and to avoid damaging the sensitive IGBT gate oxide structure, strict requirements are imposed on manufacturing facilities.
