ABSTRACT

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

  • failure sites, operational loads, and failure mechanism
  • intrinsic device sensitivities
  • electromigration
  • hot carrier aging
  • time dependent dielectric breakdown
  • mechanical stress induced migration
  • alpha particle sensitivity
  • electrostatic discharge (ESD) and electrical overstress
  • latch-up
  • qualification
  • screening
  • guidelines for designing reliability

    Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
  • chapter 1|1 pages

    Introduction

    chapter 2|3 pages

    How Devices Fail

    chapter 3|6 pages

    Intrinsic Device Sensitivities

    chapter 4|6 pages

    Electromigration

    chapter 5|6 pages

    Hot Carrier Aging

    chapter 6|6 pages

    Time-Dependent Dielectric Breakdown

    chapter 7|5 pages

    Mechanical Stress-Induced Migration

    chapter 8|4 pages

    Alpha particle Sensitivity

    chapter 10|4 pages

    Latchup

    chapter 11|11 pages

    Design for Reliability

    chapter 12|57 pages

    Process Development

    chapter 13|54 pages

    Manufacturing

    chapter 14|9 pages

    Qualification

    chapter 15|12 pages

    Screening

    chapter 16|4 pages

    Summary