ABSTRACT
An approach for effective risk management through virtual qualification begins with integrated circuit (IC) and package definitions using the package design interface, followed by stress analysis. Periodic reliability monitoring tests are also used to alert the manufacturer if process controls fluctuate beyond acceptable levels. After the stress analysis is complete, the reliability assessment software is used in any one of four modes. The first mode is virtual qualification of an existing component design. The second mode is a what-if study in design-for-reliability. In the third mode, acceleration factors must be used to transform a failure distribution at accelerated test conditions to a projected failure distribution at standard use or storage conditions. In the fourth mode, the effect of manufacturing tolerances on failures, such as the effect of variations in die attach thickness on subsequent die attach fatigue failure must be evaluated.
