ABSTRACT
This chapter contains tables that summarize number of different mechanisms that impact integrated circuit (IC) component reliability. The failures are caused by material wear-out due to the high stresses associated with their use in ICs, but they are also manifested in all three portions of the bathtub curve, mostly due to interactions with defects and/or design sensitivities. Application of the knowledge of the fundamental physics of failures, as well as an understanding of the design and business realities associated with the IC industry, are the paths to more and better design for reliability practices. In addition, it is clear that the philosophy of design for reliability must also encompass concurrent engineering practices, where all sources of information are leveraged at the earliest phases in product development. The chapter summarizes the factors that are the source of the technical concerns posed by the deep sub micron technologies.
