ABSTRACT
Polyimides (PIs) are a class of polymers used extensively in microelectronics. They are particularly attractive as interlevel dielectrics in integrated circuit fabrication, in part because of low relative permittivity [1], low losses over a wide frequency range [2], and high breakdown voltages [1,3]. In addition, PIs tend to be chemically inert in the presence of many solvents [4], mechanically tough and flexible [5], and many are thermally stable up to 450°C [3].
