ABSTRACT
Polyimides have been used in microelectronic device applications such as passivation coatings, a-particle barriers, and interlayer dielectrics in manufacturing integrated circuits because they have good thermostability and planarization ability. Photosensitive polyimides have attracted much attention because a number of processing steps are required if using a usual photoresist process to produce fine structures on a substrate with conventional polyimides. They would be expected to be essential materials for manufacturing photonics devices as well, incorporating with the progress in the fine processing technology. One example of the intrinsically photosensitive polyimides contains the photosensitive groups in the main chain, and the other is those containing the photosensitive groups in the side chain. Transparent polyimides attract many interests, not only from the viewpoint of application to photonics materials, thermostable wave guides, liquid crystal display, and so on, but also from the strategy to increase the photoreactivity of photosensitive polyimides.
