Second and Third Level Packaging Considerations for the use of Electronic Hardware at Elevated Temperatures

This chapter focuses on the materials and technologies required to assemble the devices into an electronic system that is fully functional at temperatures greater than 125°C. It provides information on the ever-growing list of organic substrates for high-temperature use. The chapter details research aimed at the development of high-temperature solders and conductive adhesives. It covers reliability issues related to the use of connector assemblies at elevated temperatures and provides guidelines for the development of high-temperature interconnect system. The chapter discusses engineered polymer housing materials used both as covers for separable connectors and as cases for the entire electronic subsystem. It addresses effects due to the degradation of the plastic housing at elevated temperature, such as motion and misregistration of the pins or electrical leakage through the housing. In high-temperature electronics applications, the second level interconnect must operate under severe environmental conditions with temperatures that can cyclically vary from –55 up to 200°C.