ABSTRACT
In nanoimprint lithography (NIL), one of the important issues is defect in the demolding process. To eliminate the defect, several approaches have been proposed, for example, by applying antisticking coatings on mold surfaces, reducing friction between the mold and resin materials, and using novel demolding methods. The demolding load per unit area of the mold linearly increases by resin stretching. The stress induced at the bottom boundary of the mold to the residual layer is larger than that at the top boundary to the pattern cavity. Then, the bottom of the mold firstly separates from the residual layer and the demolding load decreases. As a result, the first peak appears in the demolding load curve. The demolding process in NIL was simulated using a modified adhesive model based on fracture mechanics. In the first stage of the demolding process, the residual resin stretched and the mold separated from the residual resin layer.
