ABSTRACT
This chapter discusses the uses of ceramic and glass materials in semiconductor packaging. It describes the types of ceramic and glass materials used in semiconductor packaging, along with their advantages and disadvantages. Ceramics and glasses used in electronic packaging are typically electrical insulators. Beryllia processing and assembly techniques tend to be similar to those of alumina, though with much greater care to prevent toxic exposure. Silicon carbide also has very high thermal conductivity and none of the toxicity issues of beryllia. Glasses are noncrystalline solids, with the random structure of liquids frozen into place as the molten glass cooled. Silver-filled glass is a suspension of silver and low-softening temperature glass particles in an organic vehicle, becoming a paste. Silver-filled glass, like gold-silicon eutectic solder alloy, is limited to those devices that can withstand elevated processing temperature and prolonged processing time.
