ABSTRACT
The increase in the number of package types matches the growth seen in the number and types of electronic products entering into common use. There are an ever-growing number of new applications for personal, healthcare, home, automotive, security, and entertainment systems. Dual leaded packages are based on mature two-sided lead frame technology utilizing either plated through hole or surface-mount technology. A ball grid array (BGA) is a package technology that employs a solder ball grid array matrix to make electrical input and output connections to a printed circuit board. BGAs offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. chip scale packages may utilize lead frames or substrates, and the substrates may be rigid or flexible. The packages may have solder balls or simply metalized lands; the lead frame version may not have external leads, as in a quad flat no-lead package.
