ABSTRACT
As mentioned in Chapter 2, in order to remove the optics excess, a
new concept of OE interconnect hardware “S-FOLM” consisting of
films with embedded thin-film devices was proposed [1, 2].
For OE module fabrication, so far, bulk chip packaging based on
flip-chip bonding has been the major technology [3, 4]. However,
the method is not suitable for S-FOLM, which has a 3-D stacked
structure, due to its thick-bulk-characteristics. Furthermore, the
method requires precise alignment of OE chips using chip-bonders
and is material and space consuming, preventing the OE modules
from a drastic cost reduction.
