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A dual-reaction mechanism for direct copper plating on nonconductors via Pd activation and sulfur promotion
DOI link for A dual-reaction mechanism for direct copper plating on nonconductors via Pd activation and sulfur promotion
A dual-reaction mechanism for direct copper plating on nonconductors via Pd activation and sulfur promotion
BookMetallized Plastics 5&6: Fundamental and Applied Aspects
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Edition 1st Edition
First Published 1998
Imprint CRC Press
Pages 6
eBook ISBN 9780429070204
ABSTRACT
Potential (V vs. SCE)