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Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment
DOI link for Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment
Changes in the adhesion strength between copper thin films and polyimide substrates after heat treatment
BookMetallized Plastics 5&6: Fundamental and Applied Aspects
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Edition 1st Edition
First Published 1998
Imprint CRC Press
Pages 20
eBook ISBN 9780429070204
ABSTRACT
K.L. Mittal (Ed.) © VSP 1998.
