ABSTRACT
During the early development of commercial microelectromechani-
cal systems (MEMS) products, the reduction of costs was inhibited
by the wide variety of non-standard manufacturing processes, ma-
terials and packaging. In many cases, packaging was the dominant
cost. In recent years, much of theMEMS industry hasmoved to using
silicon as a material, with silicon processes and standard integrated
circuit (IC)-like plastic packages (Gilleo, 2005). For example, MEMS
accelerometers are silicon-based and typically use quad flat no.
(QFN) (see Fig. 6.3) plastic packages. The QFN form is known as an
open-cavity package and is completed by the bonding of a plastic lid
to form a hermetic seal.
