ABSTRACT
So far, we have been concerned with the thermal performance of electronics enclosures as a whole. There are other issues in their design that can be as (or even more) important. Mechanical and electromagnetic issues are two major design factors that must be considered. In general, once the enclosure is designed and the prototypes are developed, a few samples are tested in environmental chambers as well as vibration (shake) tables for compliance with various standards. Designs are, then, only modified to pass the given tests and the designers, in general, know nothing about the behavior of their system in the field and any relationship that their data has to either failure rates or repair/maintenance scheduling.
