ABSTRACT
The present work adopted CFD to run 100 trials under the randomly six heat sources dispersing to be the training data. Another 30 trials were also simulated by CFD to be the validation data and the accuracy of the BNN model could be estimated after comparison with the CFD results. The CFD simulation was done by finite-volume based software, Icepak, by FLUNET Inc. In this research, the chip was mounted on a 100.2mm x 114.2mm xl.6mm PCB and assumed the thermal conductivity of the PCB is 13W/m-K under 35°C ambient temperature. In order to accelerate the calculation speed, the average convection heater transfer coefficients were given to surfaces of the heat-spreader and PCB to simulate the heat removal to the heatsink from the heat spreader and heat exchange between the PCB surface and environment. Figure 3(a) shows the model boundary conditions of the CFD model and Figure 3(b) is the temperature contour plot at the top die surface of the first training data.
