ABSTRACT

H. DESAI,1 L. XIAOLU,1 A. ENTENBERG,2 B. KAHN,3 F.D. EGITTO,4 LJ. MATIENZO,4 T. DEBIES5 and G.A. TAKACS*'1 1 Department of Chemistry, Center for Materials Science and Engineering, Rochester Institute of

1. INTRODUCTION

Poly(tetrafluoroethylene) (PTFE) is an attractive material for insulating layers between conductors, such as copper, in the packaging of high-performance electronic devices because of its excellent thermal, chemical and electrical (low dielectric constant, k) properties. However, achieving adhesion between copper and the PTFE surface is a challenging task because fluoropolymer materials are hydrophobic with low surface energies accounting for their non-stick behavior [1 - 3]. Vapor deposition studies of copper onto PTFE surfaces indicate a lack of chemical reaction between the metal and the fluoropolymer [4], Surface modification of PTFE is needed to improve adhesion.