ABSTRACT
The trend toward decreasing critical dimensions and innovative materials in integrated circuit structures poses new challenges in surface cleaning. Traditional methods for removing particulate contaminants in future generation device fabrication will not be sufficient. Precision cleaning of semiconductor substrates during integrated circuit fabrication is typically performed using wet chemical processing. Important cleaning applications include particle/residue removal for postCMP cleaning, particle/residue removal for post-dielectric etching and cleaning of metal contaminants.
