ABSTRACT
Application of Ni/epoxy conductive adhesives to integrated circuit (IC) packaging is closely related to their chemorheological behavior during processing and cure, which includes effects, at least, from temperature, shear rate, resin conversion and filler concentration in adhesives. Due to the complexity of the flow and gelation behaviors of highly filled thermosets, trial-and-error method has been traditionally employed, leading to high design and raw material costs. A scientific chemorheological model for this process will clearly be important for the design, process control and optimization purposes.
