ABSTRACT
Today, resin-based interconnection materials for electronic packaging and interconnection technologies are widely used in manufacturing of electronic devices such as flat panel displays and semiconductor/system package modules [1]. They are attractive as traditional solder alternative due to advantages of low-temperature and low cost process, finer pitch capability and environmentally clean solutions. Electrically conductive adhesives are generally composite materials composed of on insulating adhesive binder resin and a conductive filler. Depending on the conductive filler loading level, they are divided into ICAs, ACAs or NCAs. The differences based on the percolation theory between an ICA and an ACA/NCA is shown in Fig. 1. For an ICA, the electrical conductivity is provided in all x-, y-and z-directions due to high filler content, exceeding the percolation threshold.
