ABSTRACT

Hydrolysis conversion of nitrile groups at ABS surfaces into amide and carboxylate groups was investigated in order to seek a new recipe for the electroless copper plating process of ABS surfaces without etching using chromic acid. Hydrolysis conversion of nitrile groups was successfully carried out in a NaOH (70 wt%) solution at 80°C for more than 72 h, and nitrile groups were modied into amide and carboxylate groups. The hydrolysis modication was accelerated by addition of dioxane as a supplement to the NaOH solution. The hydrolysis modication when a solution of NaOH (35 wt%) and dioxane (10 wt%) was used as a reagent for the modication was accomplished at 65°C

6.1 Introduction .................................................................................................. 128 6.2 Experimental ................................................................................................ 129

6.2.1 Materials ........................................................................................... 129 6.2.2 Hydrolysis of ABS Plates and Electroless Copper Plating Process ....... 130 6.2.3 IR Spectra of the Hydrolyzed ABS Material Surfaces ..................... 130 6.2.4 XPS Spectra of the Hydrolyzed ABS Surfaces ................................ 130 6.2.5 Contact Angle of Hydrolyzed ABS Surfaces ................................... 131

6.3 Results and Discussion ................................................................................. 131 6.3.1 Hydrolysis of ABS Surfaces by Aqueous NaOH Solution ............... 131 6.3.2 Electroless Copper Plating on Hydrolyzed ABS Surfaces ............... 135 6.3.3 Acceleration of Hydrolysis Process of ABS Surfaces ...................... 136

6.4 Conclusions ................................................................................................... 138 References .............................................................................................................. 138

in 30 min. The hydrolyzed ABS plate surfaces were successfully metallized by electroless copper plating. Adhesion between the deposited copper metal and ABS plate surface passes the crosscut test. Consequently, we can propose a new recipe for electroless copper plating process without etching process using chromic acid.