ABSTRACT

This chapter describes the scientific and applied problems of creation of highperformance thermal control systems (TCSs) for equipment operating in non-hermetic compartments of a spacecraft. In such systems, heat pipes with variable thermal conductance perform the heat transport function together with controlling the device temperature, keeping the heat balance in the ‘mounting place of device-device-space environment’ system at the required device temperature level. Heat balance equations are the basis for defining the thermal parameters of constituent elements of the system: heat pipe, radiator, thermal insulation, flexi ble elements, low conductance stand-offs, cables and contact resistances, providing the function of passive temperature regulation. Proposed conceptions of systems with heat pipes do not foresee subsidiary

CONTENTS

10.1 Introduction ................................................................................................ 357 10.2 Survey of Heat and Mass Transfer Research of Variable

Conductance Heat Pipes ........................................................................... 358 10.3 Main Heat Balance Correlations in Passive TCSs for

Thermostating Autonomous Devices ..................................................... 373 10.3.1 Principles of Operation of TCSs on GLHPs for

Autonomous Devices .................................................................... 376 10.4 Integration of Heat Pipe TCS in PCB Design .........................................386 10.5 Thermal Control of Devices without Heat Generation ........................ 393 10.6 Thermal Control of Small Satellite Compartments .............................. 398 10.7 Conclusions ................................................................................................. 399 Acknowledgements ............................................................................................405 Nomenclature ......................................................................................................406 References .............................................................................................................406