ABSTRACT
The processor’s die surface where the heat is generated is usually small (~1 cm2). For effective cooling, least temperature gradient would be required between the heat source and the radiating components. The best-known devices for effective heat transfer with the lowest thermal resistance are heat pipes and vapour chambers. Basically, heat pipes and vapour chambers are two-phase heat transfer devices and comprise an evacuated and sealed container that contains a small quantity of working fluid. One end of the container is heated, causing the liquid to vaporise and the vapour to move to the cold end and condense. As the latent heat of evaporation
5.5.4 Case Study 4: Large-Scale Loop Heat Pipe for Geothermal Heat Extraction ............................................................................... 179
5.5.5 Case Study 5: Bakery Waste Heat Recovery .............................. 180 5.5.6 Case Study 6: Heat Pipe Turbine ................................................. 182 5.5.7 Case Study 7: Thermosyphon-Based Thermoelectric
Generation System for a Solar Pond ............................................ 183 5.5.8 Case Study 8: Concentrated Solar Thermoelectric
Generator with PCM Thermal Storage ....................................... 189 5.5.9 Case Study 9: Ultra-Large Heat Pipes for Cooling the Earth .. 191 5.5.10 Case Study 10: Heat Pipe Application for a Nuclear Reactor .. 196
5.5.10.1 Decay Heat ....................................................................... 197 5.5.10.2 Heat Pipe ECCS ............................................................... 198 5.5.10.3 Gravity-Assisted Water Charging ................................ 198 5.5.10.4 Loop-Type Heat Pipe System ......................................... 199 5.5.10.5 Heat Pipe Thermal Analysis ..........................................200 5.5.10.6 Reactor Thermal Analysis ............................................. 203
5.6 Concluding Remarks ................................................................................. 207 References ............................................................................................................. 210
is large, considerable quantities of heat can be transported with a very small temperature difference from end to end. Thus, it is a device of very high thermal conductance. Its equivalent thermal conductivity can be several hundred times than that of a solid copper (Cu) device of the same dimensions.
