ABSTRACT
Electronic devices make up a large percentage of the hazardous lead waste that is landfilled. As a result, the electronic assembly community is beginning to investigate the option of lead-free soldering for its industry. As lead (Pb) is beginning to be eliminated from electronic assembly, manufacturers must be aware of the solder alloy choices available to them and the fact that not all alloys share the same characteristics. Possible driving forces behind this Pb-free solder movement are legislation, marketing pressures, and/or trade barriers.
