ABSTRACT

IC and miniaturization science are taking increasingly separate paths in adopting preferred lithography strategies. For ICs, throughput and finer geometries are needed, and batch processing is a prerequisite. In miniaturization science, modularity, good depth of focus (DOF), extension of the z-direction, that is, the height of features (skyscraper-type structures), incorporating nontraditional materials (e.g., gas-sensitive ceramic layers, polymers), and replication methods catch the spotlight, and batch fabrication is not always a prerequisite. While reading the current chapter, these important differences in

characteristics of IC manufacture and miniaturization science should be kept in mind.