ABSTRACT
Once the fabrication of the MEMS device has been completed, parts are obtained and assembled, protected, and tested. These parts can consist of one or more die resulting from a surface micromachined or bulk micromachined process or, alternatively, an object such as a gear, rotor, or seismic mass resulting from a bulk micromachined or LIGA process. The parts obtained from a MEMS fabrication process are rarely the end product. A number of steps need to be accomplished once the MEMS fabrication is done in order to produce a MEMS product such as a sensing device (e.g., accelerometer, pressure sensor); an optical device (e.g., the TI DLP‘); or a switch. The major issues for packaging of MEMS devices include handling, thermal budget, mechanical stress, encapsulation, and device motion requirements.
