ABSTRACT
Yield is one of the cornerstones of a successful integrated circuit (IC) manufacturing technology along with product performance and cost. Many factors contribute to the achievement of high yield but also interact with product performance and cost. A fundamental understanding of yield limitations enables the up-front achievement of this technology goal through circuit and layout design, device design, materials choices, and process optimization. Defect, failure, and yield analyses are critical issues for the improvement of IC yield. Finally, the yield improvement is essential to success.
