ABSTRACT
The control of the deposition thickness is crucially important in the LCVD operation, regardless of the modes of operation. However, it is very difficult to measure the actual thickness of ultrathin film deposited on polymeric substrates. If an LCVD film is deposited on polymeric substrates, such as films, fibers, and molded articles, it is nearly impossible to determine the thickness by a simple nondestructive method that can be done quickly enough to monitor the LCVD operation. In order to circumvent this problem, the use of special substrates added or attached to the normal substrate is found to be satisfactory. A small piece of Si wafer is a typical case of this approach. Ellipsometer can measure the deposition on the Si wafer easily and quickly, which provides thickness and refractive index values.
