ABSTRACT
In contrast to argon plasma, in which the sputtering of metal from the electrode is the primary process, the deposition of polymeric materials via plasma polymerization predominantly takes place in methane plasma. In such a polymer-forming plasma, the sputter deposition of electrode materials is considered as a secondary process, and the extent of the sputtering of metal depends on the plasma polymerization conditions, the nature of the electrode material, and the magnetic field strength.
Furthermore, in this type of plasma the polymeric materials deposit not only on the substrate but also on the electrode surfaces. Thus, the sputter deposition of metal in polymer-forming plasmas is more complicated than that in non-polymer-forming plasmas.
