ABSTRACT
Figure 17.30 shows the relationship between Ar sputtering rate and system pressure with a strong anode magnetron. It shows that the Ar sputtering rate distribution is not uniform with respect to radial distance from the center. The Ar sputtering rate increases in the focused area with the decrease of system pressure. In the focused area, the sputtering rate at p¼ 10mtorr is almost four times greater than that at p¼ 50mtorr. However, near the edge of the glass tube, when the system pressure is lowered, the Ar sputtering rate can decrease below zero, i.e., deposition occurs. This is because the CDST e2, which increases with the decrease of system pressure [1], becomes larger than the gap distance causing the redeposition of sputtered particles, as explained earlier.
