Characterization of thermomechanical behaviour of a flip-chip plastic ball grid array package assembly

Ball grid array (BGA) packaging technology has matured rapidly in the past decade. It allows the attachment of high I/O single- or multi-chip modules directly to a standard printed circuit board (PCB). This investigation contributed to the understanding of the thermomechanical behaviour of flip-chip plastic ball grid array (FC-PBGA) package assemblies, with an emphasis on the effect of substrate deformation on solder ball strains.