ABSTRACT
Along with the growth of the electronics industry, electronic systems are getting faster, smaller, lighter and more thermally challenging. At the same time, the use of electronic equipment has been widespread in communications, computations, automations, biomedical, space, and other purposes. All these effects have led to more stringent requirements for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) shielding design of electronic systems. Mechanical and electrical design interfaces are challenging, especially for new product development, in which critical and early design decisions have to be made, either assuming EMC can be achieved with good electronic design to obviate the need for an EMI shield or anticipating the inclusion of an EMI shield (Arnold, 2003). Moreover, the EMI shielding design should be optimized to meet the EMC requirements while keeping costs as low as possible. This also has increased the demand for choosing the right EMI shielding materials and for developing new materials for EMI shielding applications.
