ABSTRACT
The continued miniaturization of surface-mounted devices (SMDs) and the increasing density of the printed circuit board (PCB) have made it necessary to shield different zones of a device from one another to achieve the desired levels of functional performance in the electronic system. Among different levels of shielding methods, board-level shielding is a low-cost way and can be used to reduce the electromagnetic interference (EMI) shielding requirements for the overall enclosure, even completely removing the need for enclosure-level shielding (Armstrong, 2004).
