ABSTRACT
This chapter provides a fundamental context of materials corrosion in aqueous solution on the basis of the current state of corrosion science. The corrosion of metals and semiconductors involves anodic and cathodic charge-transfer processes across the material-solution interface and is hence under the control of the interfacial potential. We describe how semiconductor corrosion differs from metallic corrosion, emphasizing the importance of the interfacial potential and the electrode potential. Passivation occurs not only with metals but also with semiconductors, resulting in the protection of the materials. Passivity breakdown causes localized corrosion such as pitting and crevice corrosion. We discuss the stability of pitting corrosion and crevice corrosion with the criterion of the polishing and the active modes of metal dissolution, proposing a potential-dimension diagram for localized corrosion. Finally, we survey the influence of corrosion precipitate oxides on metallic corrosion and show that the ion-selective property and the semiconductive property of the oxides may affect the corrosion of underlying metals.
