ABSTRACT
The study of liquid drop transfer from one surface to another through elongating a liquid bridge formed between surfaces has undergone an intense development in recent years. Such a transfer process can be widely seen in our daily lives and has a number of applications, for example, printing industry, drop deposition, packaging industry, and microgripping [1-11]. For example, during the printing, ink is transferred from the substrate to the target surface through the liquid bridge. Recently, several studies have been performed to fabricate high resolution microscale electrical circuits and semiconductors with such a transfer technique [7-9].
