ABSTRACT
In the preceding chapters, the thermal contact resistance between the filler particles and the matrix was neglected. The temperatures were assumed to be continuous across the filler-matrix interfaces. Thermal contact resistance arises in situations where there is poor adherence between the particles and the matrix [1-7]. Also, when the coefficients of thermal expansion of dispersed phase and matrix are significantly different from each other, voids or gap may develop between the two phases resulting in contact resistance.
