ABSTRACT
Recently, intense interest has been shown in the development of silsesquioxane-based materials because of their three-dimensional (3D) nature, ability to offer a very high degree of functionalization, ease of synthesis, and typically high thermal stability. This is evidenced by the fact that at present, there are approximately three reviews on silsesquioxanes and the related silicates.1-3 These references describe their potential application in a broad range of areas from biomedical to organic light-emitting diodes, to nanocomposites, and so on. In the literature data, there is a lot of information about the dependence of the properties of the substance on the polyorganosiloxane organic framing at the silicon atom. For example, polyorganosiloxanes containing aromatic radicals different from polydimethylsiloxanes are characterized by high thermostability and dielectric characteristics.4
