ABSTRACT
There is recent intense interest in the development of silsesquioxane based materials because of their 3D nature, their ability to offer a very high degree of functionalization, their ease of synthesis and typically high thermal stability. This is evidenced by the fact that now there are some 3 reviews on silsesquioxanes and the related silicates [1-3]. These references describe their potential application in a broad range of areas from biomedical, to organic light emitting diodes, to nanocomposites and etc. In the literature data a lot of information about depending of the substance properties on the polyorganosiloxane organic framing at the silicon atom. For example, polyorganosiloxanes containing aromatic radicals different from polydimethylsiloxanes are characterized by high thermostability and dielectric cha racteristics [4].
