ABSTRACT
The objective of this chapter is to apply the electroless plating of Cu-Ni-P alloy on conducting polymers using hypophosphite as the reducing agent to the preparation of conductive fabrics and to investigate effects of operating parameters on the deposition rate. Electroless plating of Cu-Ni-P alloy on fabrics and effect of plating parameters on the properties of alloy coated fabrics as well as electromagnetic interference (EMI) shielding effectiveness were reported in detail. In this research conductive fabrics obtained with high shielding effectiveness.
