ABSTRACT
Contents 11.1 Introduction to 2D Flexible Electronics .................................................. 302 11.2 Fabrication of MoS2 Device on Both Rigid and Flexible Substrate ..... 303 11.3 Y-Function Method for Extracting Mobility and Contact Resistance .... 306
11.3.1 Introduction to the Y-Function Method ....................................306 11.3.2 Mobility Underestimation from Gm,max ...................................... 307 11.3.3 Y-Function Robust Analysis for Contact
Resistance Extraction ....................................................................309 11.3.4 Comparison between Contact Resistance Extraction
Methods .......................................................................................... 312 11.3.5 Conclusion ...................................................................................... 313
11.4 Device Mechanics: Failure Mechanisms under Strain ......................... 313 11.4.1 Failure Mechanisms from Bending Test .................................... 313 11.4.2 Cracks in Inorganic Dielectrics: Stretching Test ...................... 313 11.4.3 Approaches to Improve Device Flexibility .................................314
