ABSTRACT
The insulating substrate serves as the supporting structure for the circuitry of the power module.
It acts as the surface for depositing conductive, dielectric, and resistive materials that form the passive circuit elements. It is also a base for mechanical support for all active and passive chip components. It must be strong enough to withstand different environmental stresses. Electrically, it must be an insulator to isolate various conductive paths of the circuit. It must be able to withstand an RMS AC voltage (50 to 60 Hz) of 2500 V applied between any terminal and the case, including the base plate, for a one-minute duration. It must have sufficient thermal conductivity to remove the heat generated by the components.
